Point-Of-Load DC-DC converter

• New series of µPOL™ power solutions, ushers in ‘a new era of power management
solutions’ with increased performance, smallest available size, ease of use and simplified integration
• Scalable and highly configurable with multi-time programmable memory, offering a wide range of flexibility
• Suitable for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise
• World premiere at APEC 2019 in Anaheim, CA, March 18 to 20 at the TDK booth 811

TDK Corporation (TSE:6762) announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise.

Rather than using side by side discrete integrated circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high-density solution for space-constrained applications requiring a low-profile power source.
At 3.3 x 3.3 x 1.5 mm, they minimize the required external components, retaining the highest possible performance while offering a simplified design for ease of integration. This family can deliver a high density solution of 1 watt per mm 3 , while offering 50% less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.

TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. µPOL™ were developed by TDK’s group company Faraday
Semi. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

μPOL™ technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs and others. By minimizing the distance between the converter and the chipset, the resistance and the inductance components are minimized, allowing fast response and accurate regulation with dynamic load currents.

The product family is rated for industrial application, is lead free and has ROHS compliance.

Glossary
• μPOL™ and nPOL™ are integrated DC-DC converters placed in the vicinity of complex ICs such as
ASICs, FPGAs, and others.
Main applications
• Network Storage: Enterprise SSD / Storage Area Network
• Servers: Main Stream Server, Rack and Blade Server, Micro Server
• Netcoms and Telecoms: Ethernet Switch and Router and 5G Small Cells and 5G Base Stations
• Automotive (Future)
Main features and benefits
• Footprint of 3.3 x 3.3 x 1.5 mm
• Output of 1 watt per mm 3 , with 50% less required capacitance than existing products
• Suitable for a junction temperature range from -40°C to 125°C
μPOL™, nPOL™ and The Future of Integrated Technology™ are registered trademarks of Faraday Semi


LQ Relay Introduction

1 Form A/1 Form C 10A Small power relays

TYPICAL APPLICATIONS

1. Home appliances

• Refrigerators

• Cooking ovens

• Washing machine

• Air conditioners

2. Industrial equipment

• Motor control

• Robot

• Power supplyFEATURES

1. Miniature size and small: 10(W) × 20(L) × 16(H) mm .394(W) × .787(L) × .630(H) inch

2. Compact with high capacity: 1 Form A and 1 Form C, 10 A

3. Class “F” coil is available

4. Contact rating at 105°C 221°F is approved by UL/C-UL (Class “F” coil only)

Please refer to “SAFETY STANDARDS” about the detail of contact rating.

5. Surge 8,000 V, High breakdown voltage 4,000 V (Between contact and coil)

TYPES:

Standard packing: Carton 100 pcs., Case 500 pcs.

DIMENSIONS (mm inch)1 from A

1 from C

PCB PATTERN (mm inch)

1 from A

1 from C

SAFETY STANDARDS : UL,CSA,CQC,VDE,RoHS.

Board to Board CONNECTOR: Novastack 35-P

Key Feature:

  1. Stack Height : 0.70mm(Nominal)
  2. Space saving design : Depth is only 2.3mm
  3. Operator friendly by metal guide
  4. insert molded plug for robust structure
  5. Hold down can be a terminal for power supply.(max. 2A/pin)

Number of positions:

14, 18, 20, 24, 30, 34, 40, 50, 60P

Ordering Code:

Plug connector

20708-0**E-01

Receptacle connector

20709-0**E-01

Specifications:

DIMENSIONS

20708-0**E-01

20709-0**E-01

Side View:

20708-0**E-01

20709-0**E-01

Material:

20708-0**E-01

20709-0**E-01

HE-N Relay Introduction

1a/1c/2a/2c/5A/10A power relays for power supply

TYPICAL APPLICATIONS

1. Home appliances

TV sets, VCR, Microwave ovens

2. Office machines

Photocopiers, Vending machines

3. Industrial equipment

NC machines, Robots, Temperature controllers

FEATURES

1. Miniature package with universal terminal footprint

2. High dielectric withstanding for transient protection: 10,000 V surge in ìs between coil and contact

3. Sealed construction

4. Class B coil insulation types available

5. VDE, TÜV, SEMKO, SEV, FIMKO also approved

6. Sockets are available

TYPES:

Board to Board CONNECTOR: Novastack 35-HDP

Key Feature:

  1. Number of positions: 42P+4P, 56P+4P
  2. Mating eight: 0.75mm max
  3. High data rate transfer (20Gbps)
  4. Complete effective shielding
  5. 2.2A power pin * 4 for power delivery

Number of positions:

42p+4p (power pins)

56p+4p (power pins)

Ordering Code:

Plug connector (Housing)

20697-0**E-01

Receptacle connector20698-0**E-01

Specifications:

DIMENSIONS 20697-0**E-01

20698-0**E-01

Side View:

20697-0**E-01

20698-0**E-01

Material:

20697-0**E-01

20698-0**E-01

Board to Board CONNECTOR: Novastack 4

Key Feature:

  1. Mating Height : 0.6mm (Nom.)
  2. Depth : 1.86mm Super small connector
  3. W-Point contact with high mating reliability
  4. Two point supporting structure provide good click feeling and stable retention force
  5. Ni barrier for anti-solder wicking function (both Plug / Rece

Number of positions:

10,24 , 30 , 34 , 40

Ordering Code:

Plug connector (Housing)

20641-0**E-01

Receptacle connector20642-0**E-01

PhotoMos GU SOP4 1 From A

Miniature SOP4-pin type of 60V/350V/400V load voltage

FEATURES:

1. Controls low-level analog signals

PhotoMOS feature extremely low closedcircuit offset voltage to enable control of low-level analog signals without distortion.

2. Small SOP4-Pin package

The device comes in a miniature SOP4- pin type measuring (W)4.3 × (L)4.4 × (H)2.1 mm (W).169 × (L).173   (H).083 inch

3. Low-level off state leakage current of max. 1 ìA

4. Load voltage 60V, 350V and 400V types available

TYPICAL APPLICATIONS:

• Telecommunication (PC, electronic notepad)

• Measuring and testing equipment

• Factory automation equipment

• Security equipment

• Computers • Industrial robots.

Photovoltaic MOSFET Driver

Photovoltaic MOSFET drivers of wide variation

FEATURES:

1. High-speed switching

Since release time is Typ. 0.1 ms, the MOSFET can be turned off quickly in a urgent situation.

2. High insulation

DIP type: 5,000 Vrms

SOP type: 2,500 Vrms

SSOP type: 1,500 Vrms

3. Extensive product lineup

Products include SSOP, SOP4-pin and DIP6-pin.

TYPICAL APPLICATIONS:

  • Power supply (Vcc) for electronic circuits
  • Driving MOSFET

FPC CONNECTOR: MINIFLEX 175-ST

FPC CONNECTOR: MINIFLEX 175-ST

Key Feature:

  1. Profile Height : 0.52mm(0.57mm max)
  2. Smallest FPC connector in the world
  3. Provides high FPC retention force & prevents diagonal mating by mechanical LOCK with cutout
  4. Sufficient wiping length insures reliable contact
  5. Enhanced temporary FPC holding mechanism by LIF structure
  6. Prevention of contact distortion by fingermails during actuator unlock operation
  7. FPC/FFC contact : Top

CA series of stacked MEGACAP Type MLCCs with high capacitance and low ESR

Multilayer ceramic chip capacitors
CA series of stacked MEGACAP Type MLCCs
with high capacitance and low ESR
• Broad capacitance range from 20 nF to 150 µF
• Available with C0G, X7T, X7S, and X7R temperature characteristics

TDK Corporation has developed a new series of vertically stacked MEGACAP Type MLCCsthat combine high capacitance and low ESR. The new CA series offers rated voltages from25 V to 1000 V and covers a capacitance range from 20 nF to 150 µF. The new MLCCs are available with C0G, X7T, X7S, and X7R temperature characteristics. Thanks to their high capacitance values, the new capacitors are suitable for the resonant circuits of wireless and plug-in charging systems, for example, for industrial vehicles and robots. They can also be used in smoothing and decoupling applications in industrial equipment. Production of the CA series began in April 2018. Automotive grade products will be introduced after mid-2018.

The MEGACAP Type MLCCs feature metal lead frames attached to the electrode ends of the components to protect against board flexure cracks and solder cracks from thermal shocks. The metal material of the terminal has also been optimized to lower the ESR and achieve a higher ripple current capability. In order to enable a low profile with increased capacitance, TDK has adapted its MEGACAP stack design so that the MLCC elements are stacked side by side. The vertically stacked design enables stacks with three or even more elements. Hybrid joints between the metal terminals and the MLCC are both soldered and clamped to prevent the individual MLCC elements from falling out of the lead frame at the increasingly higher reflow temperatures. The CA series will be available initially with 2x and 3x stacks. In the future the lineup will be expanded with 5x stacks. TDK offers a broad portfolio of MLCCs for a wide range of applications. TDK will continue to place a special
focus on the development of technologically superior automotive grade MLCCs.

Main applications
• Resonant circuits for wireless and plug-in charging systems
• Smoothing and decoupling applications in industrial equipment
Main features and benefits
• High capacitance enabled by stacked design
• Low ESR due to optimized terminal material

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